Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine
نویسندگان
چکیده
منابع مشابه
FRAGILITY OF Pb-FREE SOLDER JOINTS
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملFragility of Pb-free Solder Joints
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
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Experimental research on the Pb phase coarsening of eutectic Pb/Sn flip chip solder joint under current stressing is reported. Phase growth is observed under different current densities and temperatures. Higher current density leads to faster grain coarsening. Based on the test results, a grain coarsening equation including the influence of current density is proposed, dn dn 0 1⁄4 Kjmt. The cur...
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For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint re...
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Three types of inexpensive Pb-free solder joints, namely Zn-based and Bi-based solders, and a CuSn alloy were studied for application to the high-temperature operation of wide band-gap power semiconductor devices using GaN or SiC. Zn– Al solder sheets, whose melting point is 380°C were prepared, and then surface oxides were removed by RF plasma etching. Subsequently, Cu thin films were deposite...
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ژورنال
عنوان ژورنال: Journal of Welding and Joining
سال: 2014
ISSN: 2466-2232
DOI: 10.5781/jwj.2014.32.3.74